bzt52b15lp document number: ds36252 rev. 1 - 2 1 of 4 www.diodes.com april 2013 ? diodes incorporated bzt52b15lp new product surface mount precision zener diode features ? small leadless surface mount package ? ideally suited for automated assembly processes ? tight tolerance on zener breakdown voltage (2%) ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) mechanical data ? case: x1-dfn1006-2 ? case material: molded plastic, "green" molding compound. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020 ? terminal connections: cathode bar (see marking information) ? terminals: finish ? nipdau over copper leadframe. solderable per mil-std-202, method 208 ? weight: 0.001 grams (approximate) ordering information (note 4) part number case packaging BZT52B15LP-7B x1-dfn1006-2 10,000/tape & reel notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. 4. for packaging details, go to our website at http?//www.diodes.com /products/packages.html. marking information bottom view 6l= product type marking code: x1-dfn1006-2 e4 6l
bzt52b15lp document number: ds36252 rev. 1 - 2 2 of 4 www.diodes.com april 2013 ? diodes incorporated bzt52b15lp new product maximum ratings (@t a = +25c, unless otherwise specified.) characteristic symbol value unit forward voltage @ i f = 10ma v f 0.9 v thermal characteristics characteristic symbol value unit power dissipation (note 5) t a = +25c p d 250 mw thermal resistance, junction to ambient air (note 5) t a = +25c r ja 500 ? c/w operating and storage temperature range t j, t stg -65 to +150 ? c electrical characteristics (@t a = +25c, unless otherwise specified.) type number marking code zener voltage range (note 6) maximum zener impedance f = 1khz maximum reverse current (note 6) temperature coefficient @ i ztc mv/c test current i ztc maximum capacitance (note 7) v z @ i zt i zt z zt @ i zt z zk @ i zk i zk i r @ v r c t nom (v) min (v) max (v) ma ? ma a v min max ma pf bzt52b15lp 6l 15 14.70 15.30 5 15 200 1 0.05 10.5 9.2 13.0 5 100 notes: 5. device mounted on fr-4 pcb with minimum recommended pad layout which can be found on our website at http://www.diodes .com. 6. short duration pulse test used to minimize self-heating effect. 7. f = 1mhz, v r = 0v, t a = +25c. 0 50 100 0 255075100125150 p , p o we r dissi p a t i o n (mw) d t , ambient temperature (c) figure 1 power derating curve a 150 200 250 300 note 5 0.1 1 10 100 1000 200 400 600 800 1000 1200 1400 1600 v , instantaneous forward voltage(mv) figure 2 typical forward characteristics f i , ins t an t ane o u s f o r wa r d f c u r r en t (ma) t = 25c a t = 85c a t = 125c a t = 150c a t = -55c a
bzt52b15lp document number: ds36252 rev. 1 - 2 3 of 4 www.diodes.com april 2013 ? diodes incorporated bzt52b15lp new product v , zener voltage (v) figure 3 typical zener breakdown characteristics z i, zene r c u r r en t (ma) z 12 13 14 15 16 17 18 0.01 0.1 1 10 100 package outline dimensions please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. x1-dfn1006-2 dim min max typ a 0.47 0.53 0.50 a1 0 0.05 0.03 b 0.45 0.55 0.50 d 0.95 1.075 1.00 e 0.55 0.675 0.60 e - - 0.40 l 0.20 0.30 0.25 r 0.05 0.15 0.10 all dimensions in mm dimensions value (in mm) c 0.70 g 0.30 x 0.40 x1 1.10 y 0.70 l e b r e d a1 a x 1 y c x g
bzt52b15lp document number: ds36252 rev. 1 - 2 4 of 4 www.diodes.com april 2013 ? diodes incorporated bzt52b15lp new product important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does di odes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com
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